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Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints

Liang Zhang (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Song‐bai Xue (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Li‐li Gao (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Zhong Sheng (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Wei Dai (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Feng Ji (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Huan Ye (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China)
Yan Chen (Harbin Welding Institute, Harbin, China)
Sheng‐lin Yu (College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing, China The 14th Research Institute, China Electronics Technology Group Corporation, Nanjing, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 8 February 2011

426

Abstract

Purpose

The purpose of this paper is to explore the formation and growth mechanism of bulk Cu6Sn5 intermetallic compounds, selecting Sn‐Ag‐Cu‐Ce solders as specimens.

Design/methodology/approach

In order to further enhance the properties of SnAgCu solder, trace amount of rare earth Ce was selected as alloying addition into the alloy; in previous investigations, the enhancements include better wettability, physical properties, creep strength and tensile strength. In this paper, the microstructure of Sn‐Ag‐Cu‐Ce soldered joints and its interfacial intermetallic compounds were investigated. Moreover, different morphologies of Cu6Sn5 IMCs were enumerated and described, and Ostwald ripening theory was employed to interpret the formation mechanism of bulk Cu6Sn5 IMCs.

Findings

In addition, based on finite element simulation, it is found that the von Mises stress concentrate around the bulk Cu6Sn5 IMCs inside the Sn‐Ag‐Cu‐Ce soldered joints after three thermal cycling loading (−55‐125°C). From the stress distribution, the failure site was predicted to fracture near the bulk Cu6Sn5 IMCs interface. This coincides with the experimental findings significantly.

Originality/value

The results presented in this paper may provide a theory guide for developing novel lead‐free solders as well as reliability investigation of lead‐free soldered joints.

Keywords

Citation

Zhang, L., Xue, S., Gao, L., Sheng, Z., Dai, W., Ji, F., Ye, H., Chen, Y. and Yu, S. (2011), "Effects of bulk Cu6Sn5 intermetallic compounds on the properties of Sn‐Ag‐Cu‐Ce soldered joints", Soldering & Surface Mount Technology, Vol. 23 No. 1, pp. 4-9. https://doi.org/10.1108/09540911111099640

Publisher

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Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited

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