Experimental investigation on the failure of lead‐free solder joints under drop impact

Abstract

Purpose

The purpose of this paper is to investigate the mechanism of ball grid array (BGA) lead‐free solder joint failure under board‐level drop impact.

Design/methodology/approach

A round shaped test board was used. First, drop tests at three different heights were carried out. Then, dye stain testing and metallurgical analysis were performed in order to study the failure mechanism of lead‐free solder joints under drop impact.

Findings

The test results indicate that the combined effect of mechanical shock and printed circuit board bending vibration is the root cause of solder joint failure under drop impact. On the other hand, the fracture of BGA lead‐free solder joints occurs at the intermetallic compound interface near the package side, and the failure mode is brittle fracture.

Originality/value

These results are the same as those for JEDEC standard test boards. The round test board could take the place of the JEDEC standard test board when conducting drop testing.

Citation

Liu, F., Meng, G. and Zhao, M. (2010), "Experimental investigation on the failure of lead‐free solder joints under drop impact", Soldering & Surface Mount Technology, Vol. 22 No. 3, pp. 36-41. https://doi.org/10.1108/09540911011054172