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Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders

T.K. Yeh (Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, Republic of China)
K.L. Lin (Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, Republic of China)
B. Salam (Department of Materials Science and Engineering, National Cheng Kung University, Tainan, Taiwan, Republic of China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 18 September 2009

283

Abstract

Purpose

The purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3 and 0.5) solder alloys.

Design/methodology/approach

The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400°C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin‐film X‐ray diffractometry (thin‐film XRD) to identify the elements present on the surface of the studied solders.

Findings

The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high‐temperature oxidation behaviour of the studied solder. AES and thin‐film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn‐based oxide layers.

Originality/value

The findings of this paper will help provide an understanding of the effects of silver on Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solder.

Keywords

Citation

Yeh, T.K., Lin, K.L. and Salam, B. (2009), "Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders", Soldering & Surface Mount Technology, Vol. 21 No. 4, pp. 19-23. https://doi.org/10.1108/09540910910989394

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited

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