Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders
Abstract
Purpose
The purpose of this paper is to study the influence of silver on the high‐temperature oxidation behaviour of the Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga (x=0, 0.1, 0.3 and 0.5) solder alloys.
Design/methodology/approach
The weight gains of the studied solders are measured using thermal gravimetric analyzers (TGA) at temperatures of 250, 300, 350 and 400°C. The weight gains measured are used to compare the oxidation behaviour of the studied solders. The surfaces of the solders are also analyzed with Auger emission spectroscopy (AES) depth profiling and thin‐film X‐ray diffractometry (thin‐film XRD) to identify the elements present on the surface of the studied solders.
Findings
The TGA results show that the weight gains decrease with increasing silver content in the studied solders. It meant that increasing silver content could help improve the high‐temperature oxidation behaviour of the studied solder. AES and thin‐film XRD confirm that the formed oxide layers on the surface of the studied solder are Zn‐based oxide layers.
Originality/value
The findings of this paper will help provide an understanding of the effects of silver on Sn‐8.5Zn‐xAg‐0.01Al‐0.1Ga solder.
Keywords
Citation
Yeh, T.K., Lin, K.L. and Salam, B. (2009), "Improving high‐temperature oxidation behaviour of Sn‐Zn‐Ag‐Al‐Ga solders", Soldering & Surface Mount Technology, Vol. 21 No. 4, pp. 19-23. https://doi.org/10.1108/09540910910989394
Publisher
:Emerald Group Publishing Limited
Copyright © 2009, Emerald Group Publishing Limited