Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints

Abstract

Purpose

As the transition away from lead‐containing solders gathers momentum, isotropic conducting adhesives (ICAs) are being considered as possible replacements for conventional SnPb solder in a range of applications. Consequently, the reliability of ICA joints is under scrutiny. The purpose of this paper is to report the effect of printed circuit board (PCB) and component finishes on the reliability of ICA joints.

Design/methodology/approach

Previous work by the authors identified a suitable test regime to generate relevant reliability data. In the present work, those tests are employed to investigate whether the finishes on the components and/or PCBs have any effect on the reliability of the ICA joints after exposure to damp heat conditions.

Findings

The effect of different finishes is found to be very adhesive material dependent. Two adhesives are studied, and for one material the joint reliability is relatively unaffected by changes in component or PCB surface finish. However, for the second material, and components with a high‐tin content‐plated finish, the joints display a less stable resistance. The surface finish on the PCB is found to have a smaller effect on joint reliability than the component finish, with results dependent on adhesive material type. Performance with one material exhibited little difference in reliability irrespective of the PCB surface finish. For the second material, the joint reliability performance with components having the electroless nickel/immersion gold finish, is not as good as that with components having the immersion tin or silver finishes.

Originality/value

The paper shows that surface finish is an important factor in determining the conductivity of ICA joints during exposure to the 85°C/85%RH environment. Systems containing tin are more prone to lose conductivity and, conversely, noble metal systems are more immune to degradation. This is a major concern as the industry is showing many signs that the component termination of choice will be pure tin.

Citation

Wickham, M., Zou, L. and Hunt, C. (2009), "Measuring the effect of substrate and component finishes on the reliability of isotropic electrically conductive adhesive joints", Soldering & Surface Mount Technology, Vol. 21 No. 4, pp. 12-18. https://doi.org/10.1108/09540910910989385