The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields

Abstract

Purpose

The aim of this paper is to investigate the growth behaviours of intermetallic compound (IMC) layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in various intensities of high‐magnetic field.

Design/methodology/approach

Sn1.5Cu solder was prepared and melted in a vacuum furnace at 873 K and cast into solder bars. Samples were mounted using resin and etched after being carefully polished. Then the IMC layers were observed by using scanning electron microscopy.

Findings

The results show that the growth of IMC layers has been accelerated by high‐magnetic field through the comparison of growth kinetics of IMC layers among 0‐2.5 T magnetic filed. IMC grains in high‐magnetic field are much bigger than that in 0 T. By the analyzing of X‐ray diffractometer patterns of IMC layers, it can be found that the orientations of IMC have been changed by magnetic field.

Originality/value

This paper investigates the growth behaviour of IMC layers during the solid‐liquid interfacial reactions of Sn1.5Cu/Cu in a high magnetic field.

Citation

Cheng, C., Zhao, J., Xu, Y., Xu, F. and Huang, M. (2009), "The growth behaviours of IMC layers in solid‐liquid interfacial reactions of Sn1.5Cu/Cu in high magnetic fields", Soldering & Surface Mount Technology, Vol. 21 No. 2, pp. 14-18. https://doi.org/10.1108/09540910910947426