Thermal profiling: a reflow process based on the heating factor

Abstract

Purpose

This paper aims to offer a convenient method to develop an oven recipe for a specific soldering profile in a reflow process. The method is devised to quickly achieve proper profile shape and heating factor Q_η, a measure of success for high reliability of the solder joints reflowed.

Design/methodology/approach

An in‐depth analysis of the heating mechanism and some experiments of the reflow soldering process are performed to research on how to realize a specific shape reflow profile were conducted.

Findings

Heating mechanism analysis and experiments demonstrate that the combinatorial parameters based method is feasible to do thermal profiling.

Research limitations/implications

The mapping function among a particular configured PCBA, an oven used, a target reflow profile and an optimal range of the heating factor should be further established for fast and reliable production of reflow soldering.

Practical implications

Provides a methodology for designing an oven recipe for reflow soldering production.

Originality/value

An oven recipe can be quickly attained with the approach established in this paper, facilitating the formation of solder joints with high reliability during the reflow soldering process.

Citation

Gang Gao, J., Ping Wu, Y., Ding, H. and Hong Wan, N. (2008), "Thermal profiling: a reflow process based on the heating factor", Soldering & Surface Mount Technology, Vol. 20 No. 4, pp. 20-27. https://doi.org/10.1108/09540910810902679