The purpose of this paper is to investigate and report the impact of glass frit variation in silver thick film pastes used as surface conductors in low temperature co‐fired ceramics technology (LTCC), especially on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC.
Silver thick film paste compositions were formulated by changing the silver glass frit ratio. The compatibility of these formulated paste compositions with LTCC (DP 951AX) substrate were evaluated. The properties such as microstructure developments, the change in sheet resistance, warpage of LTCC substrate with respect to glass frit ratio of the developed silver films on LTCC were evaluated.
The results reveal that the glass frit percentage used in paste formulation is equally responsible for the disturbance in the properties such as microstructure, warping and electrical properties of the fired thick films on LTCC. It was observed that the paste composition, in particular sample SP10B containing the highest glass frit percentage, is compatible with the LTCC tape under processing conditions. The sheet resistance value in the range of 5 mΩ/□ and the fired films showed very good adhesion (3.95 N), irrespective of the glass frit composition.
The paper provides useful evaluations of properties such as microstructure developments, changes in sheet resistance and warpage of LTCC substrate with respect to glass frit ratio of the developed silver pastes on LTCC.
Bangali, J., Rane, S., Phatak, G. and Gangal, S. (2008), "Silver thick film pastes for low temperature co‐fired ceramics: impact of glass frit variation", Soldering & Surface Mount Technology, Vol. 20 No. 3, pp. 41-46. https://doi.org/10.1108/09540910810885714
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