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Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)

John Lau (Agilent Technologies, Inc., Santa Clara, California, USA)
Jerry Gleason (Hewlett‐Packard Company, Palo Alto, California, USA)
Valeska Schroeder (Hewlett‐Packard Company, Palo Alto, California, USA)
Gregory Henshall (Hewlett‐Packard Company, Palo Alto, California, USA)
Walter Dauksher (Agilent Technologies, Inc., Santa Clara, California, USA)
Bob Sullivan (High Density Packaging Users Group, Scottsdale, Arizona, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 11 April 2008

Abstract

Purpose

The purpose of this paper is to discuss the design, materials, and assembly process aspects of a study, conducted by The High Density Packaging Users Group Consortium, into process development and solder joint reliability of high‐density packages on printed circuit boards using a low‐melting temperature lead‐free solder (Sn‐57 wt%Bi‐1 wt%Ag).

Design/methodology/approach

The components studied include several SMT package types and various lead configurations. The assembly process addresses the low‐temperature lead‐free assembly process, inspection and analysis of these boards and packages.

Findings

It was found that, the assembly process of the SnBiAg lead‐free test boards is very robust and the assembly yield is almost 100 percent.

Originality/value

The paper is of value by presenting a description of the rationale and material set used for an experiment to test SMT assembly and reliability characteristics using the 57Bi‐42Sn‐1Ag alloy, which has a melting point of 139°C.

Keywords

Citation

Lau, J., Gleason, J., Schroeder, V., Henshall, G., Dauksher, W. and Sullivan, B. (2008), "Design, materials, and assembly process of high‐density packages with a low‐temperature lead‐free solder (SnBiAg)", Soldering & Surface Mount Technology, Vol. 20 No. 2, pp. 11-20. https://doi.org/10.1108/09540910810871520

Publisher

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Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited