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An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications

S. Mallik (Electronics Manufacturing Engineering Research Group, School of Engineering, University of Greenwich, Kent, UK)
N.N. Ekere (Electronics Manufacturing Engineering Research Group, School of Engineering, University of Greenwich, Kent, UK)
R. Durairaj (Department of Engineering, Faculty of Engineering and Science, University Tuanku Abdul Rahman (UTAR), Kuala Lumpur, Malaysia)
A.E. Marks (Electronics Manufacturing Engineering Research Group, School of Engineering, University of Greenwich, Kent, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 11 April 2008

Abstract

Purpose

The purpose of this paper is to investigate the rheological behaviour of three different lead‐free solder pastes used for surface mount applications in the electronic industry.

Design/methodology/approach

This study concerns the rheological measurements of solder paste samples and is made up of three parts. The first part deals with the measurement of rhelogical properties with three different measuring geometries, the second part looks into the effect of frequencies on oscillatory stress sweep measurements and the final part reports on the characterisation and comparison of three different types of Pb‐free solder pastes.

Findings

Among the three geometries, the serrated parallel plate was found effective in minimising the wall‐slip effect. From the oscillatory stress‐sweep data with different frequencies; it was observed that the linear visco‐elastic region is independent of frequency for all the solder paste samples. To understand the shear thinning behaviour of solder paste, the well known Cross and Carreau models were fitted to the viscosity data. Moreover, creep‐recovery and dynamic frequency‐sweep tests were also carried out without destroying the sample's structure and have yielded useful information on the pastes behaviour.

Research limitations/implications

More extensive research is needed to fully characterise the wall‐slip behaviour during the rheological measurements of solder pastes.

Practical implications

The rheological test results presented in this paper will be of important value for research and development, quality control and facilitation of the manufacturing of solder pastes and flux mediums.

Originality/value

This paper shows how wall‐slip effects can be effectively avoided during rheological measurements of solder pastes. The paper also outlines how different rheological test methods can be used to characterise solder paste behaviours.

Keywords

Citation

Mallik, S., Ekere, N.N., Durairaj, R. and Marks, A.E. (2008), "An investigation into the rheological properties of different lead‐free solder pastes for surface mount applications", Soldering & Surface Mount Technology, Vol. 20 No. 2, pp. 3-10. https://doi.org/10.1108/09540910810871511

Publisher

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Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited