Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue

Andreas R. Fix (Robert Bosch GmbH, Gerlingen, Germany)
Wolfgang Nüchter (Robert Bosch GmbH, Gerlingen, Germany)
Jürgen Wilde (Institut für Mikrosystemtechnik, Albert‐Ludwigs‐Universität Freiburg im Breisgau, Freiburg, Germany Lehrstuhl für Aufbau‐ und Verbindungstechnik, Dresden, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 8 February 2008

Abstract

Purpose

The purpose of this paper is to investigate the microstructural development of SnAgCu solder joints under different loading conditions (isothermal storage, thermal cycling and vibration).

Design/methodology/approach

The observed microstructural changes have been studied with respect to grain growth and grain refinement, crack formation and crack growth. The growth kinetics of the intermetallic phases encountered as particles in the bulk as well as a reaction layer on the copper pad, were studied in the temperature range of 125‐175°C.

Findings

Dynamic recrystallisation of the tin matrix leads to a change in the diffusion controlled growth mechanism, which causes an increase of the particle growth rate compared to isothermal storage. Thus, these grain boundaries are separated forcibly by crack growth during thermal cycling. This stress causes intergranular cracks while vibration stress induces transgranular cracks.

Originality/value

The paper adds insight into microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue.

Keywords

Citation

Fix, A., Nüchter, W. and Wilde, J. (2008), "Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue", Soldering & Surface Mount Technology, Vol. 20 No. 1, pp. 13-21. https://doi.org/10.1108/09540910810861440

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited

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