This paper aims to present a viscoplastic constitutive model of Sn‐Pb solder taking into account the evolution of microstructure and damage growth in the material.
The microstructure evolution is represented by a parameter describing the coarsening of the phase size, and its resulting evolution equation is established from previous experimental data. The damage evolution is derived from the theory of damage mechanics within the framework of irreversible thermodynamics. Both a phase‐size parameter and a damage variable are included in the constitutive model.
The model is capable of simulating the effects of Sn‐Pb solder microstructure on mechanical behaviour for both bulk material and miniature specimens under monotonic tensile loading. It was found that the expected failure location determined using the phase‐size criterion is identical to that using the damage criterion, but differs from that determined using the von Mises stress criterion.
Microstructure and damage evolution are modelled for Sn‐Pb solder. Some simulation results are compared with the experimental data to provide the necessary validation of the damage/microstructure‐coupled constitutive model.
Wei, Y., Chow, C., Fang, H., Lu, W. and Lim, J. (2006), "Modelling of microstructure and damage evolution in Sn‐Pb solder", Soldering & Surface Mount Technology, Vol. 18 No. 1, pp. 44-51. https://doi.org/10.1108/09540910610647107Download as .RIS
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