TY  - JOUR
AB  - Purpose– Provide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance.Design/methodology/approach– A series of test vehicles designed to evaluate the RF performance on various test patterns and some simple circuits. Empirical testing is used in determining the data.Findings– Provides a methodology for checking the performance of flux residues as well as information on the performance of a few different flux residue types.Research limitations/implications– This is not an all encompassing project and the results may not extrapolate out to higher frequency ranges.Practical implications– A good source of reference that can be used to understand the impacts of the assembly process on RF performance.Originality/value– This paper shows the effect of assembly materials (flux residues) on a real circuit and not just test patterns. It can give a basic understanding to process engineers of the potential impact of the assembly process on a RF circuit.
VL  - 17
IS  - 4
SN  - 0954-0911
DO  - 10.1108/09540910510630403
UR  - https://doi.org/10.1108/09540910510630403
AU  - Geiger David
AU  - Shangguan Dongkai
PY  - 2005
Y1  - 2005/01/01
TI  - Investigation of the effect of solder flux residues on RF signal integrity using real circuits
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
SP  - 27
EP  - 32
Y2  - 2024/05/07
ER  -