Provide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance.
A series of test vehicles designed to evaluate the RF performance on various test patterns and some simple circuits. Empirical testing is used in determining the data.
Provides a methodology for checking the performance of flux residues as well as information on the performance of a few different flux residue types.
This is not an all encompassing project and the results may not extrapolate out to higher frequency ranges.
A good source of reference that can be used to understand the impacts of the assembly process on RF performance.
This paper shows the effect of assembly materials (flux residues) on a real circuit and not just test patterns. It can give a basic understanding to process engineers of the potential impact of the assembly process on a RF circuit.
Geiger, D. and Shangguan, D. (2005), "Investigation of the effect of solder flux residues on RF signal integrity using real circuits", Soldering & Surface Mount Technology, Vol. 17 No. 4, pp. 27-32. https://doi.org/10.1108/09540910510630403Download as .RIS
Emerald Group Publishing Limited
Copyright © 2005, Emerald Group Publishing Limited