Investigation of the effect of solder flux residues on RF signal integrity using real circuits

David Geiger (Flextronics, San Jose, California, USA)
Dongkai Shangguan (Flextronics, San Jose, California, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 2005



Provide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance.


A series of test vehicles designed to evaluate the RF performance on various test patterns and some simple circuits. Empirical testing is used in determining the data.


Provides a methodology for checking the performance of flux residues as well as information on the performance of a few different flux residue types.

Research limitations/implications

This is not an all encompassing project and the results may not extrapolate out to higher frequency ranges.

Practical implications

A good source of reference that can be used to understand the impacts of the assembly process on RF performance.


This paper shows the effect of assembly materials (flux residues) on a real circuit and not just test patterns. It can give a basic understanding to process engineers of the potential impact of the assembly process on a RF circuit.



Geiger, D. and Shangguan, D. (2005), "Investigation of the effect of solder flux residues on RF signal integrity using real circuits", Soldering & Surface Mount Technology, Vol. 17 No. 4, pp. 27-32.

Download as .RIS



Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

Please note you might not have access to this content

You may be able to access this content by login via Shibboleth, Open Athens or with your Emerald account.
If you would like to contact us about accessing this content, click the button and fill out the form.
To rent this content from Deepdyve, please click the button.