Investigation of the effect of solder flux residues on RF signal integrity using real circuits

David Geiger (Flextronics, San Jose, California, USA)
Dongkai Shangguan (Flextronics, San Jose, California, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 2005

Abstract

Purpose

Provide information on the effects of flux residues from surface mount assembly on radio frequency (RF) performance.

Design/methodology/approach

A series of test vehicles designed to evaluate the RF performance on various test patterns and some simple circuits. Empirical testing is used in determining the data.

Findings

Provides a methodology for checking the performance of flux residues as well as information on the performance of a few different flux residue types.

Research limitations/implications

This is not an all encompassing project and the results may not extrapolate out to higher frequency ranges.

Practical implications

A good source of reference that can be used to understand the impacts of the assembly process on RF performance.

Originality/value

This paper shows the effect of assembly materials (flux residues) on a real circuit and not just test patterns. It can give a basic understanding to process engineers of the potential impact of the assembly process on a RF circuit.

Keywords

Citation

Geiger, D. and Shangguan, D. (2005), "Investigation of the effect of solder flux residues on RF signal integrity using real circuits", Soldering & Surface Mount Technology, Vol. 17 No. 4, pp. 27-32. https://doi.org/10.1108/09540910510630403

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2005, Emerald Group Publishing Limited

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