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Dissolution of solids in contact with liquid solder

Samjid Mannan (Department of Mechanical Engineering, King's College London, Strand, London, UK)
Michael P. Clode (Department of Mechanical Engineering, King's College London, Strand, London, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2004

Abstract

The dissolution rate of a solid metal such as Cu, in contact with molten solder can be calculated with the use of the Nernst‐Brenner equation. We describe how this equation should be correctly used in cases when the solder is in contact with both the base metal and any intermetallic compounds that have formed. We also show that the concentration of solute in the solder will generally lie between the metastable solubility limit and the equilibrium solubility limit, illustrating these ideas with reference to a system comprising Nb as the base metal and eutectic In‐Sn as the solder, where the concentration levels can be directly correlated to the crystal growth rate.

Keywords

Citation

Mannan, S. and Clode, M.P. (2004), "Dissolution of solids in contact with liquid solder", Soldering & Surface Mount Technology, Vol. 16 No. 3, pp. 31-33. https://doi.org/10.1108/09540910410562509

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited