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Thermal cycling reliability of lead‐free chip resistor solder joints

Jeffrey C. Suhling (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
H.S. Gale (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
R. Wayne Johnson (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
M. Nokibul Islam (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
Tushar Shete (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
Pradeep Lall (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
Michael J. Bozack (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
John L. Evans (Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA)
Ping Seto (DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA)
Tarun Gupta (DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA)
James R. Thompson (DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Abstract

The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead‐free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin‐lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (−40‐125°C and −40‐150°C) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn‐Ag‐Cu (SAC) alloy recommended by earlier studies (95.5Sn‐3.8Ag‐0.7Cu), and three variations of the lead‐free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.

Keywords

Citation

Suhling, J.C., Gale, H.S., Wayne Johnson, R., Nokibul Islam, M., Shete, T., Lall, P., Bozack, M.J., Evans, J.L., Seto, P., Gupta, T. and Thompson, J.R. (2004), "Thermal cycling reliability of lead‐free chip resistor solder joints", Soldering & Surface Mount Technology, Vol. 16 No. 2, pp. 77-87. https://doi.org/10.1108/09540910410537354

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited