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Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Eric C.C. Yan (Department of Mechanical Engineering, Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Kowloon, Hong Kong)
S.W. Ricky Lee (Department of Mechanical Engineering, Electronic Packaging Laboratory, Hong Kong University of Science and Technology, Kowloon, Hong Kong)
X. Huang (Foxconn Ltd, Shenzhen, People's Republic of China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2004

Abstract

This paper presents an experimental study to assess the reliability of solder ball attachment to the bond pads of PBGA substrate for various plating schemes. The basic structure of the under bump metallisation is Cu/Ni/Au. Three different kinds of electroless plating solutions are used to deposit the Ni layer, namely, Ni‐B, Ni‐P (5 per cent), and Ni‐P (10 per cent). Also, conventional electrolytic Ni/Au plating is performed to provide a benchmark. After solder ball attachment, mechanical tests are conducted to characterize the ball shear strength for comparison. Furthermore, some specimens are subjected to multiple reflows to investigate the thermal aging effect.

Keywords

Citation

Yan, E.C.C., Ricky Lee, S.W. and Huang, X. (2004), "Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate", Soldering & Surface Mount Technology, Vol. 16 No. 2, pp. 21-26. https://doi.org/10.1108/09540910410537318

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited