The High Density Packaging Users Group conducted a substantial study of the solder joint reliability of high‐density packages using lead‐free solder. The design, material, and assembly process aspects of the project are addressed in this paper. The components studied include many surface mount technology package types, various lead, and printed circuit board finishes and paste‐in‐hole assembly.
Smetana, J., Horsley, R., Lau, J., Snowdon, K., Shangguan, D., Gleason, J., Memis, I., Love, D., Dauksher, W. and Sullivan, B. (2004), "Design, materials and process for lead‐free assembly of high‐density packages", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 53-62. https://doi.org/10.1108/09540910410517068Download as .RIS
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