Electrically conductive adhesives are considered to be strong candidates for replacing toxic lead‐based solders. The present work has focused on thermal fatigue cracking of isotropic conductive adhesive (ICA) joints. The initiation and propagation of cracks in the ICA joints were investigated with scanning electron microscopy. A linear elastic finite element analysis has been performed to analyse the stress distribution in the ICA joint and correlate the critical stress concentrations with the observed crack initiation sites. The effect of joint configurations on thermal stresses was also evaluated with numerical calculations.
Mo, Z., Lai, Z., Li, S. and Liu, J. (2004), "Thermal fatigue cracking of surface mount conductive adhesive joints", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 48-52. https://doi.org/10.1108/09540910410517059Download as .RIS
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