TY  - JOUR
AB  - The electronics industry will implement lead‐free soldering in the near future. Lead‐free implementation steps are divided into lead‐free process and lead‐free product. The eutectic Sn/Ag/Cu alloy seems to have become the most widely used alloy in the implementation of lead‐free processes. In this study, the requirements for component placement are discussed from the lead‐free process point of view. Experiments concerning the self‐alignment capability and tack strength of both tin‐lead and lead‐free solder pastes are presented. According to the results, a bigger variation in self‐alignment capabilities can be expected when using a lead‐free paste. The paste properties affecting the self‐alignment mechanism and tack strength are also discussed.
VL  - 16
IS  - 1
SN  - 0954-0911
DO  - 10.1108/09540910410517040
UR  - https://doi.org/10.1108/09540910410517040
AU  - Liukkonen Timo
AU  - Nummenpää Pekka
AU  - Tuominen Aulis
PY  - 2004
Y1  - 2004/01/01
TI  - The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
SP  - 44
EP  - 47
Y2  - 2024/04/24
ER  -