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The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow

Timo Liukkonen (Nokia Corporation, Salo, Finland)
Pekka Nummenpää (Nokia Corporation, Salo, Finland)
Aulis Tuominen (Tampere University of Technology, Pori, Finland)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2004

Abstract

The electronics industry will implement lead‐free soldering in the near future. Lead‐free implementation steps are divided into lead‐free process and lead‐free product. The eutectic Sn/Ag/Cu alloy seems to have become the most widely used alloy in the implementation of lead‐free processes. In this study, the requirements for component placement are discussed from the lead‐free process point of view. Experiments concerning the self‐alignment capability and tack strength of both tin‐lead and lead‐free solder pastes are presented. According to the results, a bigger variation in self‐alignment capabilities can be expected when using a lead‐free paste. The paste properties affecting the self‐alignment mechanism and tack strength are also discussed.

Keywords

Citation

Liukkonen, T., Nummenpää, P. and Tuominen, A. (2004), "The effect of lead‐free solder paste on component placement accuracy and self‐alignment during reflow", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 44-47. https://doi.org/10.1108/09540910410517040

Publisher

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Emerald Group Publishing Limited

Copyright © 2004, Emerald Group Publishing Limited