The mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15 per cent Pb, Sn/2 per cent Bi, and Sn) are studied in this work using a lead pull test and free fall drop test. The results of this study show that the Sn/2 per cent Bi coated components provide the best performance under the drop impact loading followed by the Sn/15 per cent Pb, Sn and Ni/Pd/Au coated components. Failure modes and the structure of the coating surfaces were examined from cross‐sectioned samples using a scanning electron microscope. Furthermore, the wetting of the leads by the solder and thickness of the IMC layers were studied.
Arra, M., Castello, T., Shangguan, D. and Ristolainen, E. (2004), "Characterization of mechanical performance of Sn/Ag/Cu solder joints with different component lead coatings", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 35-43. https://doi.org/10.1108/09540910410517031Download as .RIS
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