A study of the Sn‐Ag‐Cu lead‐free solder reflow profile has been conducted. The purpose of the work was to determine the Sn‐Ag‐Cu reflow profile that produced solder bumps with a thin intermetallic compound (IMC) layer and fine microstructure. Two types of reflow profiles were studied. The results of the experiment indicated that the most significant factor in achieving a joint with a thin IMC layer and fine microstructure was the peak temperature. The results suggest that the peak temperature for the Sn‐Ag‐Cu lead‐free solder should be 230°C. The recommended time above liquidus is 40 s for the RSS reflow profile and 50‐70 s for the RTS reflow profile.
Salam, B., Virseda, C., Da, H., Ekere, N. and Durairaj, R. (2004), "Reflow profile study of the Sn‐Ag‐Cu solder", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 27-34. https://doi.org/10.1108/09540910410517022Download as .RIS
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