TY  - JOUR
AB  - The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.
VL  - 16
IS  - 1
SN  - 0954-0911
DO  - 10.1108/09540910410517013
UR  - https://doi.org/10.1108/09540910410517013
AU  - Lau John
AU  - Dauksher Walter
AU  - Smetana Joe
AU  - Horsley Rob
AU  - Shangguan Dongkai
AU  - Castello Todd
AU  - Menis Irv
AU  - Love Dave
AU  - Sullivan Bob
PY  - 2004
Y1  - 2004/01/01
TI  - Design for lead‐free solder joint reliability of high‐density packages
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
SP  - 12
EP  - 26
Y2  - 2024/04/25
ER  -