The lead‐free solder joint reliability of several printed circuit board mounted high‐density packages, when subjected to temperature cycling was investigated by finite element modelling. The packages were a 256‐pin plastic ball grid array (PBGA), a 388‐pin PBGA, and a 1657‐pin ceramic column grid array. Emphasis was placed on the determination of the creep responses (e.g. stress, strain, and strain energy density) of the lead‐free solder joints of these packages.
Lau, J., Dauksher, W., Smetana, J., Horsley, R., Shangguan, D., Castello, T., Menis, I., Love, D. and Sullivan, B. (2004), "Design for lead‐free solder joint reliability of high‐density packages", Soldering & Surface Mount Technology, Vol. 16 No. 1, pp. 12-26. https://doi.org/10.1108/09540910410517013Download as .RIS
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