Thermal strain analysis of an electronics package using the SEM Moiré technique
Abstract
This paper reports on a study of the scanning electron microscope (SEM) Moiré method. Tests were carried out by rotating the specimen grating slightly with respect to the electron scanning raster lines, to verify that the Moiré images captured were really due to the interference between specimen and reference gratings. The experimental results coincided well with the calculated theoretical values and with small measurement errors. Then, the shear strains experienced by the solder joints of a flip‐chip ball grid array specimen were investigated using the SEM Moiré method. The results were compared with those obtained using the optical Moiré method.
Keywords
Citation
Zhong, Z.W. and Nah, S.K. (2003), "Thermal strain analysis of an electronics package using the SEM Moiré technique", Soldering & Surface Mount Technology, Vol. 15 No. 3, pp. 33-35. https://doi.org/10.1108/09540910310505107
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited