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Flip chip solder joint reliability under harsh environment

Cheng Bo (Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, People’s Republic of China)
Wang Li (DaimlerChrylser SIM Technology Co., Ltd, Shanghai, People’s Republic of China)
Zhang Qun (DaimlerChrylser SIM Technology Co., Ltd, Shanghai, People’s Republic of China)
Gao Xia (DaimlerChrylser SIM Technology Co., Ltd, Shanghai, People’s Republic of China)
Xie Xiaoming (Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences, Shanghai, People’s Republic of China DaimlerChrylser SIM Technology Co., Ltd, Shanghai, People’s Republic of China)
Wolfgang Kempe (DaimlerChrylser Research and Technology, Frankfurt, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 December 2003

322

Abstract

Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.

Keywords

Citation

Bo, C., Li, W., Qun, Z., Xia, G., Xiaoming, X. and Kempe, W. (2003), "Flip chip solder joint reliability under harsh environment", Soldering & Surface Mount Technology, Vol. 15 No. 3, pp. 15-20. https://doi.org/10.1108/09540910310505071

Publisher

:

MCB UP Ltd

Copyright © 2003, MCB UP Limited

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