Process characterization of PCB assembly using 0201 packages with lead‐free solder
Abstract
0201 assembly plays a very important role in the continuing miniaturization of electronics products. After a systematic study using Sn‐Pb solder paste on pad design, machine evaluation, component qualification, and process optimisation, this study focused on the PCB assembly process for 0201 packages using Sn‐Ag‐Cu solder paste. The post‐reflow solder defects for a range of different spacings were examined for the different solder pastes.
Keywords
Citation
Geiger, D., Mattsson, F., Shangguan, D., Ong, M., Wong, P., Wang, M., Castello, T. and Yi, S. (2003), "Process characterization of PCB assembly using 0201 packages with lead‐free solder", Soldering & Surface Mount Technology, Vol. 15 No. 2, pp. 22-27. https://doi.org/10.1108/09540910310479495
Publisher
:MCB UP Ltd
Copyright © 2003, MCB UP Limited