Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging

Abstract

This paper presents a reliability assessment of adhesive joints using chip‐on‐glass (COG) technology which was conducted by testing samples at various aging temperatures and at high humidity.The range of aging temperatures took into account the glass transition temperature (Tg) of the adhesive films. The effects of high temperature and high humidity on the bond strength of flip‐chip‐on‐glass joints were evaluated by shear testing as well as by microstructural examination.It was found that aging generally caused a decrease in shear strength while the aging temperature was below the glass transition temperature of ACF. When the aging temperature was slightly above the Tg of the ACF, a significant decrease in shear strength was observed. Moreover, results from scanning electronic microscopy revealed the presence of some voids near the component bumps, resulting in high stresses at the high aging temperature. DSC results showed that the ACF was not fully cured, allowing moisture absorption more seriously than a fully cured ACF, leading to joint degradation.

Citation

Lawrence Wu, C.M. and Chau, M.L. (2002), "Degradation of flip‐chip‐on‐glass interconnection with ACF under high humidity and thermal aging", Soldering & Surface Mount Technology, Vol. 14 No. 2, pp. 51-58. https://doi.org/10.1108/09540910210427826