Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards

Abstract

The wetting performance and intermetallic formation of a Sn/Ag/Cu alloy on printed circuit board (PCB) surfaces and on component terminations were studied in this work. Two different PCB surface finishes, immersion gold over electroless nickel (Ni/Au) and an organic solderability preservative (OSP), were studied. Chip components with Sn/Pb coating and a gull‐wing type component with 100% Sn coating were used in these experiments. Different reflow profiles were tested, and the dependence of the wetting performance, intermetallic layer thickness and the microstructure of the solder joints on the reflow profile were investigated.It was found that reflow process conditions did not significantly influence the spreading or intermetallic formation on either of the surfaces. Neither the wetting onto the component nor the general microstructure of the solder joints varied significantly with the reflow profile. When a Sn/Pb ‐coated component was used, the content and size of Pb‐rich phases in the solder joint increased with a longer time above liquidus or a higher reflow peak temperature.

Citation

Arra, M., Shangguan, D., Ristolainen, E. and Lepistö, T. (2002), "Effect of reflow profile on wetting and intermetallic formation between Sn/Ag/Cu solder components and printed circuit boards", Soldering & Surface Mount Technology, Vol. 14 No. 2, pp. 18-25. https://doi.org/10.1108/09540910210427781