Development and validation of lead‐free wave soldering process

Atso Forstén (Teleste Access Systems, Littainen, Finland)
Hector Steen (Multicore Solders, Hemel Hempstead, UK)
Ian Wilding (Multicore Solders, Hemel Hempstead, UK)
Jürgen Friedrich (Ersa Löttechnik, Wertheim, Germany)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 1 December 2000


Though lead‐free replacements for SnPb eutectic alloys for reflow, wave, and hand soldering have been developed, relatively little has been reported on practical experience of lead‐free wave soldering processes. In wave soldering, the interaction between the PCB, flux, solder alloy and processing equipment makes it desirable to develop the consumables and the wave soldering machine concurrently. A crossfunctional project team was formed and a lead‐free wave soldering process developed and validated through nine months of industrial use in production of broad‐band communications technology products.



Forstén, A., Steen, H., Wilding, I. and Friedrich, J. (2000), "Development and validation of lead‐free wave soldering process", Soldering & Surface Mount Technology, Vol. 12 No. 3, pp. 29-34.

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Copyright © 2000, MCB UP Limited

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