Owing to the demands of increasing I/O counts and thermal performance BGA (ball grid array) type packaging concepts are rapidly gaining in popularity. Use of various modelling tools is an obvious way to save resources by discarding the most unreliable solutions before wasting testing capacity. A testing procedure was created and then evaluated. Two components were assembled on test boards and the assembled boards were temperature cycled from –40 to +125°C. Parametric 3D FE‐models (finite element) of the components were generated and models were verified. Environmental conditions were added to assess the lifetimes of the assemblies in the targeted environment. Some differences in the TBGAs board level reliability were found. With all contributions of parameters the first failures happened after 1,000 cycles. FE‐modelling combined with accelerated stress testing proved to be an effective tool for test result analysis and for rationalising the test sequences.
Pennanen, V., Tammenmaa, M., Reinikainen, T., Zhu, J. and Lin, W. (2000), "TBGA reliability in telecom environment", Soldering & Surface Mount Technology, Vol. 12 No. 2, pp. 42-47. https://doi.org/10.1108/09540910010331509
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