To read the full version of this content please select one of the options below:

The impact of underfill properties on the thermomechanical reliability of FCOB assembly

Jicun Lu (Georgia Institute of Technology, Atlanta, Georgia, USA)
Jianhua Wu (Institute of Microelectronics, Singapore)
Yih Pin Liew (Institute of Microelectronics, Singapore)
Thiam Beng Lim (Institute of Microelectronics, Singapore)
Xiangfu Zong (Fudan University, Shanghai, China)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 August 2000

Abstract

The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill/chip passivation interface, and underfill internal cracks. An attempt was made to correlate these failures with underfill properties such as the coefficient of thermal expansion (CTE), modulus, glass transition temperature (Tg), and adhesive strength to the chip. Additionally, nonlinear finite element analysis (FEA) was conducted to verify the experimental results.

Keywords

Citation

Lu, J., Wu, J., Pin Liew, Y., Beng Lim, T. and Zong, X. (2000), "The impact of underfill properties on the thermomechanical reliability of FCOB assembly", Soldering & Surface Mount Technology, Vol. 12 No. 2, pp. 37-41. https://doi.org/10.1108/09540910010331455

Publisher

:

MCB UP Ltd

Copyright © 2000, MCB UP Limited