TY  - JOUR
AB  - As the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping method of choice for device pitches down to 150‐200μm. However, limitations in print quality and stencil manufacture mean that this technology is not likely to move significantly below this pitch and new methods will be required to meet the demands predicted by the technology roadmaps. This paper describes experiments conducted on carriers made from silicon for bumping of die using solder paste. An anisotropic etching process was used to generate pockets in the silicon surface into which solder paste was printed. Die were then placed against the carrier and reflowed to transfer the solder directly to the bondpads. An assessment was carried out of the potential application and limitations of this technique for device pitches at 225 and 127μm.
VL  - 12
IS  - 1
SN  - 0954-0911
DO  - 10.1108/09540910010312366
UR  - https://doi.org/10.1108/09540910010312366
AU  - Hutt David A.
AU  - Rhodes Daniel G.
AU  - Conway Paul P.
AU  - Mannan Samjid H.
AU  - Whalley David C.
AU  - Holmes Andrew S.
PY  - 2000
Y1  - 2000/01/01
TI  - Investigation of a solder bumping technique for flip‐chip interconnection
T2  - Soldering & Surface Mount Technology
PB  - MCB UP Ltd
SP  - 7
EP  - 14
Y2  - 2024/09/21
ER  -