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Investigation of a solder bumping technique for flip‐chip interconnection

David A. Hutt (Loughborough University, Loughborough, Leicestershire, UK)
Daniel G. Rhodes (Loughborough University, Loughborough, Leicestershire, UK)
Paul P. Conway (Loughborough University, Loughborough, Leicestershire, UK)
Samjid H. Mannan (Department of Mechanical Engineering, King’s College London, London, UK)
David C. Whalley (Loughborough University, Loughborough, Leicestershire, UK)
Andrew S. Holmes (Department of Electrical and Electronic Engineering, Imperial College of Science, Technology and Medicine, London, UK)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 April 2000



As the demand for flip‐chip products increases, the need for low cost high volume manufacturing processes also increases. Currently solder paste printing is the wafer bumping method of choice for device pitches down to 150‐200μm. However, limitations in print quality and stencil manufacture mean that this technology is not likely to move significantly below this pitch and new methods will be required to meet the demands predicted by the technology roadmaps. This paper describes experiments conducted on carriers made from silicon for bumping of die using solder paste. An anisotropic etching process was used to generate pockets in the silicon surface into which solder paste was printed. Die were then placed against the carrier and reflowed to transfer the solder directly to the bondpads. An assessment was carried out of the potential application and limitations of this technique for device pitches at 225 and 127μm.



Hutt, D.A., Rhodes, D.G., Conway, P.P., Mannan, S.H., Whalley, D.C. and Holmes, A.S. (2000), "Investigation of a solder bumping technique for flip‐chip interconnection", Soldering & Surface Mount Technology, Vol. 12 No. 1, pp. 7-14.




Copyright © 2000, MCB UP Limited

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