To read the full version of this content please select one of the options below:

Synthesis and characterisation of nano‐alumina hybrid polyimide films

H.R. Zhou (Harbin University of Science and Technology, Harbin, People's Republic of China)
X.G. Liu (Harbin University of Science and Technology, Harbin, People's Republic of China)
D.M. Zhao (Harbin University of Science and Technology, Harbin, People's Republic of China)
F. Lin (Harbin University of Science and Technology, Harbin, People's Republic of China)
Y. Fan (Harbin University of Science and Technology, Harbin, People's Republic of China)

Pigment & Resin Technology

ISSN: 0369-9420

Article publication date: 23 May 2008

Abstract

Purpose

The purpose of this paper is to synthesise and characterise nano‐alumina hybrid polyimide (PI) films.

Design/methodology/approach

PI nano‐composite films containing definitive contents of Al2O3 were prepared by the sol‐gel process of aluminum isopropoxide in the N, N′‐dimethylacetamide solution of polyamide acid. The films were characterised by Fourier transform infrared spectroscope, atomic forced microscope, and X‐ray fluorescent spectroscope (XRF). The thermal stability of the composite films was tested by TG.

Findings

PI nano‐Al2O3 films were prepared by the sol‐gel method. The XRF is an effective way to detect the inorganic phase of the composite films and measure the content of nano‐Al2O3.

Research limitations/implications

There are seldom reports about the PI composites containing Al2O3 through sol‐gel process.

Practical implications

PI has been widely used in the fields of aviation micro‐electron and less costly dyes.

Originality/value

Improved electricity insulation property of the PI films. Al2O3 particles were distributed homogeneously in the PI in nano‐scale by means of sol‐gel process.

Keywords

Citation

Zhou, H.R., Liu, X.G., Zhao, D.M., Lin, F. and Fan, Y. (2008), "Synthesis and characterisation of nano‐alumina hybrid polyimide films", Pigment & Resin Technology, Vol. 37 No. 3, pp. 161-166. https://doi.org/10.1108/03699420810871002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2008, Emerald Group Publishing Limited