A silver‐palladium thick film for aluminum nitride substrate

Abstract

A silver‐palladium thick film conductor for aluminum nitride (AlN) substrate has been developed. This conductor film on AlN ceramics had low sheet resistivity, high adhesion strength and good wettability with Pb‐Sn solder. The frit powder of lead borosilicate glass was used as inorganic binders to enhance the adhesion between the conductor and ceramics. After sintering the conductor film connected with the AlN substrate through frit bonding, no transition phases but a multilayer structure is present in the interface. The softening point of the glass was important to the adhesion strength of conductor film. In order to achieve good adhesion, it is necessary that the glass has a proper softening point (about 500‐650°C).

Citation

Zheng, D., Tian, M., Wang, Y. and He, W. (2003), "A silver‐palladium thick film for aluminum nitride substrate", Pigment & Resin Technology, Vol. 32 No. 1, pp. 30-33. https://doi.org/10.1108/03699420310454910