Electromagnetic modelling of short circuited coreplates

Jean‐Yves Roger (LAMEL‐EDF R&D, Département THEMIS, Clamart, France)
Emmanuel Vrignaud (LAMEL‐EDF R&D, Département THEMIS, Clamart, France)
Thomas Henneron (LAMEL‐L2EP, Bât. P2, Villeneuve d'Ascq, France)
Abdelkader Benabou (LAMEL‐L2EP, Bât. P2, Villeneuve d'Ascq, France)
Jean‐Pierre Ducreux (LAMEL‐EDF R&D, Département THEMIS, Clamart, France)



Coreplates in large generators may suffer from local short circuits. An accurate analysis is required to avoid these failures and detect them when occurring. The purpose of this paper is to develop a lamination stack model compliant with interlamination default analysis.


An electromagnetic model should account for the eddy‐current in the lamination stack. To avoid the modelling of the insulation between the steel sheets, the authors propose to introduce a condition on the fields applied between each sheet. In the case of electric fault between several sheets, the conducting domain, i.e. the sheets, is not simply connected. Then, T‐Ω formulation must be adapted to solve such problem.


The model allows to account for thin plates, insulating layers and electrical faults in electromagnetic modeling of core plates. This study leads to a first evaluation of eddy current losses in steel laminations with defaults.

Research limitations/implications

The present study does not take into account thermal effects. The next step will consist in a magneto‐thermal computation. Thus, an electromagnetic finite element software must be coupled with a thermal one. An other improvement will rely on the study of actual situation in order to evaluate the accuracy of industrial sensors and to compare with measurements.


The paper develops a lamination stack model compliant with interlamination default analysis. As far as the authors know, this is the first study on 3D electromagnetic modeling.



Roger, J., Vrignaud, E., Henneron, T., Benabou, A. and Ducreux, J. (2009), "Electromagnetic modelling of short circuited coreplates", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 28 No. 3, pp. 762-771. https://doi.org/10.1108/03321640910941016

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