Novel technique to calculate the effect of electromagnetic field of HVTL on the metallic pipelines by using EMTP program

Abstract

Purpose

The paper proposes to present the effect of the high voltage transmission lines on the metallic pipelines by calculating the induced voltage due to mutual inductance between the two circuits especially in short circuit conditions of high voltage overhead transmission lines.

Design/methodology/approach

The electro magnetic transient program (EMTP) is used to simulate the high voltage transmission lines in normal case and in different faulty case conditions. A software is built on MATLAB program (M‐file) to study the effects of various parameters on the magnitude of the induced voltage such as: separation distance between the high voltage transmission line and the metallic pipeline (horizontal distance), different cases of short circuits and normal operation case, the screening factor, and the soil resistivity.

Findings

The three‐phase to ground fault gives the least induced voltage, and phase to ground fault case is the most serious case. The induced voltage decreases with increasing the soil resistivity until 400 Ωm and after this, the induced voltage in the metallic pipeline increases with increasing the soil resistivity for all phase fault types.

Research limitations/implications

It does not deal with all types of interference such as capacitive interference.

Practical implications

This technique helps to know the electrical influence exerted by power line on a pipeline. So it can prevent the pipeline from posing a shock hazard rather than corrosion.

Originality/value

This paper presents the effect of the high voltage transmission lines on the metallic pipelines by calculating the induced voltage due to mutual inductance between the two circuits especially in short circuit conditions of high voltage overhead transmission lines.

Citation

Amer, G.M. (2007), "Novel technique to calculate the effect of electromagnetic field of HVTL on the metallic pipelines by using EMTP program", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 26 No. 1, pp. 75-85. https://doi.org/10.1108/03321640710713985