Describes the algorithm allowing recognition of cracks and flaws placed on the surface of conducting plate. The algorithm is based on sensitivity analysis in finite elements, which determines the influence of geometrical parameters on some local quantities, used as objective function. The methods are similar to that of circuit analysis, based on differentiation of stiffness matrix. The algorithm works iteratively using gradient method. The information on the gradient of the goal function provides the sensitivity analysis. The sensitivity algorithm allows us to calculate the sensitivity versus x and y, so the nodes can be properly displaced, modeling complicated shapes of defects. The examples show that sensitivity analysis applied for recognition of cracks and flaws provides very good results, even for complicated shape of the flaw.
Gawrylczyk, K.M. and Putek, P. (2004), "Adaptive meshing algorithm for recognition of material cracks", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 23 No. 3, pp. 677-684. https://doi.org/10.1108/03321640410540593
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