3D FEM models for numerical simulation of induction sealing of packaging material

Abstract

In the paper a 3D finite element method (FEM) model of induction sealing of multilayer packaging material will be presented. A parametrical analysis of the model has been performed in order to evaluate the behaviour of the system as regards the power supply frequency and insertion of high permeability materials in particular zones of the inductor. Some considerations about the difficulty of implementing the FEM model will be discussed. A comparison with experimental results has been done in order to understand the reliability of the numerical model.

Citation

Babini, A., Borsari, R., Fontanini, A., Dughiero, F. and Forzan, M. (2003), "3D FEM models for numerical simulation of induction sealing of packaging material", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 22 No. 1, pp. 170-180. https://doi.org/10.1108/03321640310452268