Design, analysis and measurement of the cost‐effective substrate of a plastic ball grid array package ‐ NuBGA

Abstract

A family of cavity‐down plastic ball grid array (PBGA) packages have been designed by split via connection (SVC) and split wrap around (SWA) methods. Because of the special designs, these packages consist of a single core of organic material and two‐metal layers of copper and are manufactured with the conventional printed circuit board (PCB) process at very low cost. The electrical performances of the packages are studied by both numerical simulations and experimental measurements. Parasitic parameters are extracted from time domain reflectometer (TDR) and time domain transmission (TDT) measurements. Cross‐talk and simultaneous switch output (SSO) noise of the packages are also investigated.

Citation

Lau, J.H., Chen, T. and Chou, T. (1999), "Design, analysis and measurement of the cost‐effective substrate of a plastic ball grid array package ‐ NuBGA", Circuit World, Vol. 25 No. 2, pp. 41-48. https://doi.org/10.1108/03056129910258333