Characterization of a non‐woven randomly dispersed short fiber laminate
Michael Pecht
(CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
Keith Rogers
(CALCE Electronic Packaging Research Center, University of Maryland, College Park, Maryland, USA)
Andre Fowler
(Intel Corporation, Chandler, Arizona, USA)
210
Abstract
Non‐woven laminates have begun to gain recognition in the electronics industry because they are generally thinner and flatter than woven laminates. This study characterizes the mechanical and thermo‐mechanical properties of non‐woven, randomly dispersed, short fiber laminates, and identifies potential failure mechanisms which must be addressed in the design and utilization of printed circuit boards using non‐woven technology.
Keywords
Citation
Pecht, M., Rogers, K. and Fowler, A. (1998), "Characterization of a non‐woven randomly dispersed short fiber laminate", Circuit World, Vol. 24 No. 3, pp. 34-37. https://doi.org/10.1108/03056129810212992
Publisher
:MCB UP Ltd
Copyright © 1998, MCB UP Limited