Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip

Abstract

The explosive growth of high‐density packaging has created a tremendous impact on the electronics assembly and manufacturing industry. Ball Grid Array (BGA), Chip Scale Packaging (CSP), Direct Chip Attach (DCA), and flip‐chip technologies are taking the lead in this advanced manufacturing process. Many major equipment makers and leading electronic companies are now gearing up for these emerging and advanced packaging technologies. In this paper, they will be briefly discussed.

Citation

Lau, J.H. (1997), "Electronics Packaging Technology Update: BGA, CSP, DCA and Flip Chip", Circuit World, Vol. 23 No. 4, pp. 22-25. https://doi.org/10.1108/03056129710370277