TY  - JOUR
AB  - The use of lead in electronics assembly operations has come under scrutiny due to health and environmental
concerns associated with lead exposure. Lead is one of the most useful metals in modern
industry; however, lead has the dubious distinction of being one of the most toxic of
metals. Increasingly restrictive government regulations on the use of lead are hastening the search
for feasible alternatives to tin‐lead solder alloys. From an electronics assembly
standpoint, there is a desire to replace lead bearing HASL (hot air solder levelling)
coatings with a metallic, lead‐free alternative. To answer these needs, Motorola have
developed a lead‐free, immersion plating technology for the surface finish of PCB
printed circuit board bond pads. The Motorola development work has focused on the
metallurgical system of tin‐bismuth, which is a simple eutectic system similar to that of
tin‐lead, featuring a minimal number of phases and a wide operating window.
VL  - 23
IS  - 2
SN  - 0305-6120
DO  - 10.1108/03056129710370169
UR  - https://doi.org/10.1108/03056129710370169
AU  - Melton C.
AU  - Fuerhaupter H.
PY  - 1997
Y1  - 1997/01/01
TI  - Lead‐free Tin Surface Finish for PCB Assembly
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 30
EP  - 31
Y2  - 2024/04/18
ER  -