TY  - JOUR
AB  - Tape ball grid array (TBGA) packages offer many of the
advantages of plastic BGAs, namely excellent durability, improved board space utilisation and ease of
surface mount assembly along with the associated yield improvements. TBGA packages go a step
further, however, and offer the added benefits of improved signal integrity, better heat dissipation, and
extendability to higher pin counts.This paper outlines the design and material selection process to
produce a low‐cost TBGA which allows the wire bonding of a die. This type of package
offers an attractive solution for applications requiring mid to high I/O capability and good electrical
and thermal properties. Preliminary results have demonstrated the feasibility of wire bonding to this
package at temperatures up to 200°C.
VL  - 22
IS  - 3
SN  - 0305-6120
DO  - 10.1108/03056129610799985
UR  - https://doi.org/10.1108/03056129610799985
AU  - Schueller R.D.
AU  - Plepys A.P.
PY  - 1996
Y1  - 1996/01/01
TI  - Design of a Low‐cost Wire Bond Tape Ball Grid Array Package
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 10
EP  - 15
Y2  - 2024/04/23
ER  -