Tape ball grid array (TBGA) packages offer many of the advantages of plastic BGAs, namely excellent durability, improved board space utilisation and ease of surface mount assembly along with the associated yield improvements. TBGA packages go a step further, however, and offer the added benefits of improved signal integrity, better heat dissipation, and extendability to higher pin counts. This paper outlines the design and material selection process to produce a low‐cost TBGA which allows the wire bonding of a die. This type of package offers an attractive solution for applications requiring mid to high I/O capability and good electrical and thermal properties. Preliminary results have demonstrated the feasibility of wire bonding to this package at temperatures up to 200°C.
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