TY  - JOUR
AB  - The mechanical and vibration responses of 225‐pin, 324‐pin and 396‐pin PBGA
(plastic ball grid array) solder joints have been determined in this study. The effects of
overload environmental stress factors on the mechanical responses of the solder joints have been
determined by bending and twisting experiments. The effects of shipping and functional environmental
stress factors on the vibration responses of the solder joints have been determined by
out‐of‐plane vibration experiments and a mathematical analysis.
VL  - 22
IS  - 1
SN  - 0305-6120
DO  - 10.1108/03056129610799912
UR  - https://doi.org/10.1108/03056129610799912
AU  - Lau J.
AU  - Gratalo K.
AU  - Schneider E.
AU  - Marcotte T.
AU  - Baker T.
PY  - 1996
Y1  - 1996/01/01
TI  - Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting,
and Vibration Conditions
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 27
EP  - 32
Y2  - 2024/04/25
ER  -