Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions

J. Lau (Hewlett‐Packard Company, Palo Alto, California, USA)
K. Gratalo (Hewlett‐Packard Company, Palo Alto, California, USA)
E. Schneider (Hewlett‐Packard Company, Palo Alto, California, USA)
T. Marcotte (Hewlett‐Packard Company, Palo Alto, California, USA)
T. Baker (Hewlett‐Packard Company, Palo Alto, California, USA)

Circuit World

ISSN: 0305-6120

Publication date: 1 April 1996

Abstract

The mechanical and vibration responses of 225‐pin, 324‐pin and 396‐pin PBGA (plastic ball grid array) solder joints have been determined in this study. The effects of overload environmental stress factors on the mechanical responses of the solder joints have been determined by bending and twisting experiments. The effects of shipping and functional environmental stress factors on the vibration responses of the solder joints have been determined by out‐of‐plane vibration experiments and a mathematical analysis.

Keywords

Citation

Lau, J., Gratalo, K., Schneider, E., Marcotte, T. and Baker, T. (1996), "Solder Joint Reliability of Large Plastic Ball Grid Array Assemblies Under Bending, Twisting, and Vibration Conditions", Circuit World, Vol. 22 No. 1, pp. 27-32. https://doi.org/10.1108/03056129610799912

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Publisher

:

MCB UP Ltd

Copyright © 1996, MCB UP Limited

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