TY  - JOUR
AB  - Various methods are described of making
separable electrical connections to MID structures. The first
part discusses the use of a copper plated,
glass filled plastic substrate as a contact surface. It is shown
that the morphology is different from that
of conventional contacts due to the presence of dendritic growths,
further that mechanical properties
like stiffness and strength are lower than for solid copper. The
second part discusses the application of
two conventional techniques ‐ elastromeric connectors and
compliant pins. Elastomeric
connectors are designed to form a high density, separable
interface using gold plated conductors.
Compliant pins pressed into plated‐through holes form very
reliable, high normal force
connections without the need for noble metal plating. Two
compliant pin designs have been tested with
plated holes in two versions, moulded and drilled. All
combinations show excellent electrical
stability; however, differences were found in mechanical
behaviour between the various pin and
hole combinations.
VL  - 22
IS  - 1
SN  - 0305-6120
DO  - 10.1108/03056129610799895
UR  - https://doi.org/10.1108/03056129610799895
AU  - van Alst G.
AU  - van Dijk P.
AU  - van Meijl F.
PY  - 1996
Y1  - 1996/01/01
TI  - MID Interconnection Considerations
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 14
EP  - 17
Y2  - 2024/04/18
ER  -