MID Interconnection Considerations

G. van Alst (AMP European Development Centre, ’s‐Hertogenbosch, The Netherlands)
P. van Dijk (AMP European Development Centre, 's‐Hertogenbosch, The Netherlands)
F. van Meijl (AMP European Development Centre, 's‐Hertogenbosch, The Netherlands)

Circuit World

ISSN: 0305-6120

Publication date: 1 April 1996

Abstract

Various methods are described of making separable electrical connections to MID structures. The first part discusses the use of a copper plated, glass filled plastic substrate as a contact surface. It is shown that the morphology is different from that of conventional contacts due to the presence of dendritic growths, further that mechanical properties like stiffness and strength are lower than for solid copper. The second part discusses the application of two conventional techniques ‐ elastromeric connectors and compliant pins. Elastomeric connectors are designed to form a high density, separable interface using gold plated conductors. Compliant pins pressed into plated‐through holes form very reliable, high normal force connections without the need for noble metal plating. Two compliant pin designs have been tested with plated holes in two versions, moulded and drilled. All combinations show excellent electrical stability; however, differences were found in mechanical behaviour between the various pin and hole combinations.

Keywords

Citation

van Alst, G., van Dijk, P. and van Meijl, F. (1996), "MID Interconnection Considerations", Circuit World, Vol. 22 No. 1, pp. 14-17. https://doi.org/10.1108/03056129610799895

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Publisher

:

MCB UP Ltd

Copyright © 1996, MCB UP Limited

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